
400G, 800G, and Terabit Pluggable Optics:
Current trend: 800G Pluggables supporting dense 400 GbE Both 400G & 800G form factor enables an economical way to implement
Co-packaged optics (CPO) integrate the optical engine directly with the switch ASIC, reducing power consumption and improving bandwidth density compared to traditional pluggable modules . The 800G CPO systems typically use silicon photonics chips with multiple channels, each handling 100–200G per lane, and include photonic integrated circuits (PICs) and electronic integrated circuits (EICs) stacked or co-located on a silicon interposer . This integration reduces the number of discrete components compared to traditional EML-based modules, which require eight separate EML chips for 800G .
Based on current market trends and production data:
While exact pricing is proprietary and varies by vendor, an 800G co-packaged photonics system is currently in the $3,000–$5,000 range per module for mass production, with early or low-volume deployments costing more. Costs are expected to decrease as silicon photonics manufacturing scales and co-packaged optics become more widely adopted in hyperscale AI and cloud data centers.

Current trend: 800G Pluggables supporting dense 400 GbE Both 400G & 800G form factor enables an economical way to implement

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